PSM Diamond Powder

PSM is a blocky uniform diamond superabrasive designed to provide a more consistent and precise tool performance in rough and fine grinding, slicing, and dicing applications used throughout the electronics industry.

The unique shape and strict size controls of the PSM diamond enable it to withstand the rigors of demanding applications better because it allows for an even distribution of cutting forces, reducing the likelihood of brittle fractures. This can be particularly important during high-speed dicing processes where the impact of the cutting can significantly wear down the blade, affecting the quality of the cuts.

PSM also enhances the surface finish of a hard substrate wafer. The consistent cutting action minimizes surface roughness and subsurface damage, leading to smoother and more uniform wafer surfaces to be lapped and polished.

Narrower PSD for Enhanced Tool Efficiency

Due to PSM's blocky surface structure and strict sizing controls, enhanced by proprietary grading processes, PSM provides toolmakers with a narrower crystal distribution, resulting in more active cutting particles. These cutting particles enhance a tool's effectiveness with the most challenging substrates, extending a tool's lifespan and throughput while minimizing the tool's downstream processing time with a better finish and fewer defects.

Minimize Chipping, Scratching, and Defects on Hard Substrate Wafers

Toolmakers aim to achieve consistent material removal with minimal surface damage at any step of the wafer manufacturing process. With Hyperion's enhanced grading and filtration technologies and consistently blocky crystals, PSM is engineered to help toolmakers minimize defects throughout manufacturing. PSM provides sizes from sub-micron to coarse, featuring consistently blocky diamond powder, high aspect ratios, and superior oversized controls. This results in less sub-surface damage or chipping from angular crystals. By minimizing chipping and defects, PSM enables improved processing capabilities, providing a high-quality surface finish on each wafer and ultimately helping end-users avoid costly defects.

Produced to improve tool wafer performance throughout the entire manufacturing process, PSM enhances the production capabilities of challenging substrates, such as silicon carbide (SiC), silicon (Si), gallium nitride, gallium arsenide, and sapphire applications. PSM supports various tools, from slicing and dicing blades to edge profiling and surface grinding wheels.

Toolmakers rely on PSM to deliver high-quality tooling for end users to achieve exceptional, precise finishes with minimal surface damage. This unique diamond powder is helping address the evolving needs of the electronics industry, constantly seeking better ways to produce wafers.

PSM Diamond Powder Chart

PSM Product Range

The above sizes are considered standard. Additional custom sizes are available upon request, pending dialogue with Hyperion. Please engage your local sales representative to inquire.